Die Attach Machine Market worth USD 2,042.9 billion by 2030

The Market Statsville Group (MSG) publishes the new report on the "Die Attach Machine Market by Component (Flip Chip Bonder and Die Bonder), by Technique (Epoxy, Soft Solder, Sintering, Eutectic, and Others), by Application (Optoelectronics, Logic, Memory, RF and MEMS, CMOS Image Sensors, LED, and Others), by Region – Global Share and Forecast to 2030".

The global die attach machine market size is expected to grow from USD 1,199.0 million in 2021 to USD 2,042.9 million by 2030, at a CAGR of 6.1% during the forecast period. Semiconductor packaging is one of the most important requirements in the global electronics industry. Die bonding materials are in high demand due to the rapidly expanding demand for semiconductor packaging. Researchers from the United States Army are developing a new method of incorporating Silicon Carbide (SiC)- powered semiconductors into modern weaponry and equipment.

The need for bonding materials is increasing as a result of having such an element from the semiconductor packaging consumption side. Jet wave machines are gaining popularity among North American manufacturers. Jet wave machines are capable of fusing components above the circuit in a short amount of time with great accuracy, and they may be used for both sintering and soldering pastes.

Global Die Attach Machine Market Segmentation

The die attach machine market has been segmented into components, techniques, applications, and regions.

• By Component (Flip Chip Bonder and Die Bonder)
• By Technique (Epoxy, Soft Solder, Sintering, Eutectic, and Others)
• By Application (Optoelectronics, Logic, Memory, RF and MEMS, CMOS Image Sensors, LED, and Others)
• By Region (North America, Europe, Asia Pacific, South America, and the Middle East & Africa)

Epoxy, by technique, holds the largest market share

By technique, the die attach machine market is characterized into epoxy, soft solder, sintering, eutectic, and others. The epoxy segment was the highest contributor to the market, with a market share of 58.5% in 2021. The epoxy die attach technique is used to adhere the die to the substrate, forming an epoxy bond. A drop of epoxy is sprayed on the packaging, and the die is placed on top of it. This process uses adhesives such as polyimide, epoxy, and silver-filled glass as die attach material to mount the die on the die pad.

Epoxy die attach is increasingly accepted for the most demanding microelectronic semiconductor packaging. They have excellent resistance to thermal cycling and mechanical shock and vibrations, which makes them trending in the die attach market. With rapid growth of automatic packaging process, epoxy die attach is a dependable, consistent, and adaptable method of component attachment.

Don't miss out on business opportunities in Die Attach Machine Market. Speak to our research analyst and gain crucial market insights that will benefit your business grow.

Asia Pacific accounts for the largest market share in the die attach machine market

Based on the regions, the global die attach machine market has been segmented across North America, Asia-Pacific, Europe, South America, and the Middle East & Africa. In 2021, North America accounted for the highest market share of 51.0% in the global die attach machine market. The region's high concentration of IC makers is projected to drive the demand for die bonder equipment. ICs are widely used in various industries, including industrial, telecommunications, data centers, consumer electronics, and automotive. For instance, ICs are utilized for sensing and processing applications in high-density storage devices such as solid-state drives and vehicles. As a result the growing number of chip fabrication facilities worldwide, the semiconductor industry in Asia is predicted to grow throughout the study period (2022-2030).

In addition, China has become a major exporter of die attach material worldwide, capturing 45% of global die attach materials production due to its higher production capacity. According to the Financial Times, China currently holds 15% of global semiconductor production capacity, which is expected to rise to 24% in the next ten years. South Korea and Taiwan are also significant challenges, with national stalwarts such as Samsung and the Taiwan Semiconductor Manufacturing Corporation (TSMC).

This research report includes a study on the development and marketing strategies, along with a study on the product portfolios and winning strategies of the leading companies operating in the die attach machine market. It also consists of the profiles of leading companies such as Dr. Tresky AG, Anza Technology, Inc, BE Semiconductor Industries N.V, Inseto UK Limited, ASM Pacific Technology Limited, Kulicke and Soffa Industries, Inc., Palomar Technologies, MicroAssembly Technologies Limited, Fasford Technology Co. Limited, and Shinkawa Limited. These market players have focused on acquisitions and expansion to gain a larger market share in the die attach machine market.

Browse the complete report: https://www.marketstatsville.com/die-attach-machine-market

About Market Statsville Group

Market Statsville Group (MSG) is a business research and consulting platform of Statsville Consulting Private Limited, based in Oklahoma, USA. MSG is the leading market research and strategy builder with the depth and breadth of solutions that perfectly suit your every need. MSG provides solutions in a wide range of industry verticals in market sizing, analysis, and intelligent business insights. MSG has experienced research analysts who are proficient at digging deep and providing various customizable data that help you make decisions with clarity, confidence, and impact. Furthermore, Market Statsville Group already benefited more than 1,000 companies each year for their revenue planning. It helped them take their disruptions/innovations early to the market by providing them research ahead of the curve.

MSG has an entire repository of research reports on more than 1,000 niche industries, 3,000 high-growth potentials markets, 5,000 data sets, and more than 12,000 company profiles.

Contact Us:

Market Statsville Group

416, East Standsberry Street, Perkins, Oklahoma 74059, USA

USA: +1-580-205-2707 | +91 702 496 8807

Email: sales@marketstatsville.com

Web: www.marketstatsville.com